TMC2225 is the next-generation product of TMC2208. The main difference from TMC2208 is that the package adopts HTSSOP as DFN, which has the same functions, better heat dissipation performance, and higher cost performance.
Choosing a selection results in a full page refresh.
Press the space key then arrow keys to make a selection.
Use left/right arrows to navigate the slideshow or swipe left/right if using a mobile device